AntiStatic PS Compound For PS Sheet

AntiStatic PS Compound For PS Sheet

Product Introduction This is a permanent antistatic PS compound engineered with HIPS as base resin and compounded with high-performance polymeric antistatic agents. It delivers stable, long-lasting electrostatic discharge protection without fading over time or being affected by humidity.
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Description

Permanent ESD PS Compound (HIPS-Based)

 

Product Name Permanent Antistatic PS Compound | HIPS-Based ESD PS Resin for Single/Multi-Layer Sheet & Vacuum Forming

 

Product Introduction This is a permanent antistatic PS compound engineered with HIPS as base resin and compounded with high-performance polymeric antistatic agents. It delivers stable, long-lasting electrostatic discharge protection without fading over time or being affected by humidity. Available in natural white color, it can be extruded into single-layer antistatic PS sheet, or 2-layer or ABA 3-layer co-extruded PS sheet for consistent performance and surface quality. The sheet achieves a surface resistivity as low as 10⁷ Ω/sq before forming, and maintains stable performance at 10⁸ Ω/sq after vacuum forming.

 

Ideal Users & Applications This compound is designed for:

  • Electronic component manufacturers & ESD packaging producers
  • Thermoforming factories making antistatic trays, clamshells & carriers
  • Sheet extruders producing single-layer / ABA multi-layer PS antistatic sheet
  • Brands requiring reliable ESD protection for semiconductors, PCBAs, connectors & sensitive electronics

 

Performance Changes After Vacuum Forming After vacuum forming / blister forming:

  • Surface resistivity stabilizes at 10⁸ Ω/sq (uniform across the formed part)
  • Antistatic performance remains permanent & non-migratory
  • Mechanical strength & impact resistance are well preserved
  • Surface smoothness & dimensional stability are maintained
  • No blooming, no powder fallout, no contamination to electronic components

 

Machine Setup to Stabilize Resistance After Stretching To minimize resistance shift caused by stretching during thermoforming:

  1. Use medium-low forming temperature to reduce over-stretching and material thinning
  2. Optimize heating time & heater distance to ensure even softening without local overheating
  3. Adopt uniform vacuum pressure for consistent wall thickness across the part
  4. Control stretch ratio within recommended limits to avoid breaking the antistatic network
  5. Use proper cooling rate to lock in the antistatic structure and stabilize resistance

 

Thermoforming Tray Mold Design Guidelines For stable ESD performance and consistent forming quality:

  1. Use generous corner radii (avoid sharp angles) to reduce extreme stretching
  2. Adopt gradual draft angles for easy demolding and uniform wall thickness
  3. Design balanced vacuum holes layout for even forming and consistent material distribution
  4. Optimize cavity depth & draw ratio to limit local thinning and resistance deviation
  5. Use polished mold surface to ensure smooth finished trays and stable surface resistivity
  6. Align mold structure with sheet extrusion direction to reduce anisotropy in resistance
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PS SHEET E8 (2)
PS SHEET NATURAL COLOR (2)

 

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